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外骨骼機械腳及虛擬實境整合系統開發

Development of an Exoskeleton and Virtual Reality Integration System

展位號碼: P24

系目前之研究方向包括:微熱傳與力學分析、微流通元件之製作、節約能源與能源工程、顯微力學解析、半導體封裝技術、光機電整合實務、微奈米檢測技術、超精密加工技術、微奈米技術之整合與應用、綠色能源、生醫機電系統、智慧型機器人、以及智慧型車輛系統等相關領域。進而協助台灣傳統機械產業之轉型與提升

The department’s current research directions include: micro heat transfer and mechanical analysis, production of micro flow components, energy conservation and energy engineering, micromechanical analysis, semiconductor packaging technology, opto-mechanical integration practice, micro-nano detection technology, and ultra-precision processing technology , integration and application of micro-nano technology, green energy, biomedical electromechanical systems, intelligent robots, and intelligent vehicle systems and other related fields.

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